Intel® B660 GAMING Motherboard with 8 1 1 Phases Hybrid Digital VRM Design*, Fully Covered Thermal Design, 2 x PCIe 4.0 M.2 with Thermal Guard, 2.5GbE Gaming LAN, WIFI 6 802.11ax , Front USB 3.2 Gen 2 Type-C®, RGB FUSION 2.0, Q-Flash Plus

Features

– Supports 12th Gen Intel® Core™ Series Processors

– Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs

– 8 1 1 Hybrid Digital VRM Design with DrMOS*

– Fully Covered Thermal Design with High Coverage VRM Heatsinks

– WIFI 6 802.11ax 2T2R & BT5 with AERO Antenna

– Fast 2.5 GbE GAMING LAN with Bandwidth Management

– Dual Ultra-Fast NVMe PCIe 4.0 x4 M.2 with Thermal Guard

– USB 3.2 Gen1 Type-C® for Fast and Versatile Connections

– Pre-installed IO Shield for easy and quick installation

– High Quality Audio Capacitors and Audio Noise Guard

– RGB FUSION 2.0 supports Addressable LED & RGB LED Strips

– Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP

– Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card

*DrMOS adopted only on Vcore/Vgt phase counts.

8 1 1 Phases Hybrid Digital VRM Design

Cleaner and more efficient power delivery to the CPU with better thermal performance ensure stability under high CPU frequencies and heavy loading.

– 8 1 1 Phases DrMOS*

– Solid capacitors to improve transient response and minimize oscillation

– 8-pin Solid Pin CPU Power Connector

* DrMOS adopted only on Vcore / VGT.

802.11ax WIFI 6

Latest Wireless solution 802.11ax WIFI 6 with new dedicated 6GHz band, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.

PCIe 4.0 Design

GIGABYTE B660 Motherboards are ready to work with the PCIe 4.0 devices which are expected to experience twice bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.

Support for DDR4 XMP Up to 4400MHz and Beyond

GIGABYTE is offering a tested and proven platform that ensures proper compatibility with profiles up to 4400MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their GIGABYTE motherboard.

Real One-piece Build

TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design.

2X Faster Than Ever

Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2 times faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.

CPU

LGA1700 socket: Support for 12th Generation Intel® Core™ i9 processors/Intel® Core™ i7 processors/Intel® Core™ i5 processors

L3 cache varies with CPU

Chipset

Intel® B660 Express Chipset

Memory

Support for DDR4 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) /3200/3000/2933/2666/2400/2133 MHz memory modules

4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory

Dual channel memory architecture

Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)

Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules

Support for Extreme Memory Profile (XMP) memory modules

Onboard Graphics

Integrated Graphics Processor-Intel® HD Graphics support:

1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz

* Support for HDMI 2.1 version and HDCP 2.3.

** Support native HDMI 2.1 TMDS compatible ports.

1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz

* Support for DisplayPort 1.2 version and HDCP 2.3

(Graphics specifications may vary depending on CPU support.)

Audio

Realtek® Audio CODEC

High Definition Audio

2/4/5.1/7.1-channel

* To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first. Please visit GIGABYTE’s website for details on configuring the audio software.

Support for S/PDIF Out

LAN

2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)

Wireless Communication Module

Intel® Wi-Fi 6 AX200 (For PCB rev. 1.0)

WIFI a, b, g, n, ac, ax, supporting 2.4/5 GHz Dual-Band

BLUETOOTH 5.2

Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate

Intel® Wi-Fi 6E AX211 (For PCB rev. 1.1)

WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands

BLUETOOTH 5.2

Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate

* Actual data rate may vary depending on environment and equipment.

Expansion Slots

1 x PCI Express x16 slot, running at x16 (PCIEX16)

* For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.

(The PCIEX16 slot conforms to PCI Express 4.0 standard.)

1 x PCI Express x16 slot, running at x4 (PCIEX4)

(The PCIEX4 slot conforms to PCI Express 3.0 standard.)

Multi-Graphics Technology

Support for AMD Quad-GPU CrossFire™ and 2-Way AMD CrossFire™ technologies

Storage Interface

CPU:

1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)

Chipset:

1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2P_SB)

4 x SATA 6Gb/s connectors

Support for RAID 0, RAID 1, RAID 5, and RAID 10

Intel® Optane™ Memory Ready

* System acceleration with Intel® Optane™ Memory can only be enabled on the M.2 connectors supported by the Chipset.

USB

Chipset:

1 x USB Type-C® port with USB 3.2 Gen 2 support, available through the internal USB header

5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)

1 x USB 2.0/1.1 port on the back panel

Chipset 2 USB 2.0 Hubs:

8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)

Internal I/O Connectors

1 x 24-pin ATX main power connector

1 x 8-pin ATX 12V power connector

1 x CPU fan header

3 x system fan headers

2 x addressable LED strip headers

2 x RGB LED strip headers

2 x M.2 Socket 3 connectors

4 x SATA 6Gb/s connectors

1 x front panel header

1 x front panel audio header

1 x USB Type-C® header, with USB 3.2 Gen 2 support

1 x USB 3.2 Gen 1 header

2 x USB 2.0/1.1 headers

1 x S/PDIF Out header

2 x Thunderbolt™ add-in card connectors

1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)

1 x serial port header

1 x reset button

1 x Q-Flash Plus button

1 x reset jumper

1 x Clear CMOS jumper

All fan headers are subject to support AIO_Pump, Pump and high performance fan with the capability of delivering up to 2A/12V @ 24W.

Back Panel Connectors

3 x USB 3.2 Gen 1 ports

5 x USB 2.0/1.1 ports

2 x SMA antenna connectors (2T2R)

1 x HDMI 2.1 port

1 x DisplayPort

1 x RJ-45 port

3 x audio jacks

I/O Controller

iTE® I/O Controller Chip

H/W Monitoring

Voltage detection

Temperature detection

Fan speed detection

Fan fail warning

Fan speed control

* Whether the fan speed control function is supported will depend on the fan you install.

BIOS

1 x 256 Mbit flash

Use of licensed AMI UEFI BIOS

PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0

Unique Features

Support for APP Center

* Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.

@BIOS

EasyTune

Fast Boot

Game Boost

ON/OFF Charge

RGB Fusion

Smart Backup

System Information Viewer

Support for Q-Flash Plus

Support for Q-Flash

Support for Xpress Install

Bundled Software

Norton® Internet Security (OEM version)

LAN bandwidth management software

Operating System

Support for Windows 11 64-bit

Support for Windows 10 64-bit

Form Factor

Micro ATX Form Factor; 24.4cm x 24.4cm